Hitachi’s SMT Exit

And then there were … 27?

Hitachi’s board today announced plans to exit the SMT component placement business, selling off certain parts of the division and closing the rest. In a press release, the firm said it would transfer the sales organization to Yamaha and cease its development and manufacturing activities.

Japan has always been the major provider of the world’s component mounters, headed such major conglomerates as Fuji, Yamaha, Juki, Sony and Panasonic. And while Hitachi’s competitors will welcome one fewer player in the market, this in all likelihood won’t shake up the industry.

Over the years it’s been widely assumed consolidation was inevitable, yet it’s taken more than a decade since the Great Tech Recession of 2001-03 for any major moves to be made.

There have been several transactions and reshufflings, of course: ASM bought Siplace (Siemens), Universal was acquired by a private equity group, as was Assembleon. Mydata was acquired by a fellow Swedish OEM. And earlier this week Dima, a small European player, was snatched up by Nordson. None of these deals has truly changed the shape of the market.

In fact, the June 2013 merger of Juki and Sony was the first major deal in which a serious player ceased to exist. Hitachi’s will be the second.

The 27 (at least) remaining players will welcome the chance to grab Hitachi’s roughly $68 million in equipment sales now in play as result of this decision. Someone’s bottom line will look at least marginally better in the coming year. But more moves will be needed before the SMT market can truly regain the types of margins needed to inspire significant commitments to innovation that were standard fare in the 1990s.

 

 

 

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About Mike

Mike Buetow is president of the Printed Circuit Engineering Association (pcea.net). He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow