Did avoiding the voids just get less important?
A new study by Rockwell Collins, RIM, Indium and Dage shows voids are not a “primary” issue to BGA solder joint integrity.
New BGA voiding requirements to be proposed to J-STD-001 task group based on study’s findings, Rockwell engineer Dave Hillman says.
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This entry was posted in Hot Wires and tagged BGA , Dage , Indium , J-STD-001 , RIM , Rockwell Collins , solder joing integrity , voids by Mike . Bookmark the permalink .
About Mike
Mike Buetow is president of the Printed Circuit Engineering Association (pcea.net). He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois.
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Hi Mike,
Interesting headline, is there any other information available in regard to this. The fact that ‘voids are not a primary issue’ suggests that there may be some other “new” findings?
/Trevor