New Podcast with Marc Benowitz of iNEMI

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Our latest podcast features Marc Benowitz, the new CEO of iNEMI. Before joininh the electronics consortium, he spent nearly 40 years at AT&T, Lucent, Alcatel-Lucent and Nokia Bell Labs, where he began as a member of the technical staff in the interconnect technology lab, and ultimately worked his way up to senior director of the reliability, hardware test and eco-environmental engineering organization.

He speaks with me about the transition from the private sector to fulltime consortia work, and his goals and priorities for iNEMI at pcbchat.com.

Shocker at Sanmina

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Jure Sola spent 26 years atop Sanmina as chairman, president and eventually CEO. His replacement lasted less than 12 months.

In a stunning announcement, Sanmina today announced the resignation of Bob Eulau as chief executive. The move is effective immediately.

Eulau was handpicked to replace Sola as chief executive of Sanmina, a move that took effect last October. At the time, Sola gushed over his successor’s abilities, stating “Bob has a deep understanding of Sanmina’s strategy, customer focus, technology offerings and day-to-day execution. I am confident we’ve selected a strong leader. Bob’s wealth of experience and strong leadership are invaluable to the strategic direction of Sanmina and are precisely what Sanmina needs for a successful future.”

What changed in a year? Often, quick changes like this are tied to financial issues or disagreements with the board over direction. Sanmina was quick to reaffirm financial guidance for its current quarter, and is on pace to surpass last fiscal year’s revenue total. At the low end of guidance, the EMS firm will top $7.1 billion, about 3% more than the prior fiscal year. In its most recent earnings call, Eulau forecast increasing margins and yield improvements.

Michael Clarke, another Sanmina alum and a current board member, will take over come Oct. 1.

PCB Chat: Flexible Circuits

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We have a new podcast available, this one with Mark Finstad and Nick Koop. Alert readers will recognize them as the authors of our popular “Flexperts” column on flexible circuit design and manufacturing. They discuss real-life flex circuit struggles and how to overcome them in this week’s chat.

Also, listeners who want to learn more about flex circuit design and manufacturing are encouraged to come listen to Mark and Nick on Thursday, Sept. 13, from 9-11 at the Santa Clara Convention Center during PCB West.

 

PCB Chat: California Prop 65, RoHS, and REACH with Brenda Baney

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Brenda Baney has been addressing product environmental regulations for over 20 years.  She began with General Motors as a materials engineer, where she was at the forefront of the automotive industries material compliance reporting.  Brenda has led internal company projects on elimination of CFCs, lead solder, hexavalent chromium, and a myriad of other substances of concern. She has been a leader within both automotive and electronics industry groups covering topics like ionic cleanliness of printed circuit boards, lead-free solder, End-of-Life Vehicle, RoHS and REACH compliance, and is considered a supply chain expert for material content reporting.

Baney was the Product Stewardship Manager for Delphi, where she led the reporting of complex material compliance data on hundreds of thousands of parts successfully. She also created an internal Conflict Minerals cross-functional team leading Delphi to be named as the Number One automotive component supplier in the 2015 Assent Conflict Minerals rating.

In March 2016, Baney founded B Cubed Consulting, where she works with automotive & other durable goods suppliers to keep strategies on course and stay up-to-date on the latest negotiations between industry and global government enforcement bodies.

She speaks about the new latest amendment to California Prop 65, plus REACH, RoHS and other related regulation issues with Mike Buetow on our latest edition of PCB Chat.

Will US Tariffs Accelerate ‘One China?’

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Asian media are reporting that major Taiwanese ODMs are looking into relocating some production to the island as means to sidestep the US tariffs on imports from China.

DigiTimes reported today that Quanta Computer and Wiwynn are among those looking to avoid new duties on server-use motherboards, which represent a major product line for both ODMs.

Quanta builds server motherboards in Shanghai, then performs final assembly in Nashville, TN, and Fremont, CA, and Wurselen, Germany. Executives say the company might expand production outside China to make up for any domestic reduction.

Wiwynn, which is part of Wistron, also has production in China. It performs performs final assembly in Mexico.

Question: With China increasingly flexing its authority over Taiwan, will moves by companies in the critical technology space accelerate or exacerbate Chinese claims to Taiwan?

Soldering 101: The Simplicity of Soldering – The Complexity of Solder Paste

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Folks,

Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC 305, requires only the liquid solder and copper to form the tin-copper intermetallic bond. This simplicity, with one small catch, was brought home to me by some colleagues at Speedline Technologies. They took a PWB with through-hole components mounted and ran it through a wave-soldering machine without using any flux. The result was comical. The PWB weighed about 10 pounds as it had huge solder ice cycles hanging off of it. Oxides that form on the copper created this mess. Running the board though again with a nitrogen blanket produced a beautifully wave-soldered board that could be ready to ship. So in reality, either a flux or nitrogen, preferably both are needed for successful wave soldering in addition to the solder and copper; however, it is still relatively simple.

Have sympathy for the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste; however, the only experience many solder scientists had was with wave soldering. In wave soldering, the flux’s main job is to remove the oxides from the PWB pads and components. The solder is in a molten state and its oxidation is not a main concern. In the soldering process, the solder only touches the board for a few seconds and the board only experiences the high temperatures during this brief period.

I imagine some early solder pastes consisted of solder powder with fluxes similar to those used in wave soldering. If so, they probably didn’t work too well. Consider the dramatic differences that solder paste experiences as compared to solder in wave soldering. The “flux” in solder paste has to remove oxides from the PWB pads, component leads, and solder particles, but it also has to protect all of these surfaces from re-oxidation for several minutes while in the reflow oven. To achieve this protection, the “flux” has to contain materials that act as an oxygen barrier. The most common materials used in no-clean solder pastes are rosins/resins. Rosins, or resins which are modified or synthetic rosins, are generally medium to high molecular weight organic compounds of 80-90% abietic acid. They are typically found in coniferous trees. Rosins/resins are tacky in nature, and provide some fluxing activity and oxidation resistance during the reflow process.

The reason I wrote “flux” in the above paragraph is that what most people call the flux in solder paste is a complex combination of materials. These “fluxes” will consist of:

    • Rosins/resins: for oxygen barrier and some fluxing activity
    • Rheological additives: to give the best printing properties, e.g., good response-to-pause, good transfer efficiency, excellent slump resistance, good tack, etc
    • Solvents: to dissolve the other materials
    • Activators: to perform the main fluxing action (removing oxides)

      Figure. Solder pastes are one of the most highly engineered materials.

Modern solder pastes must have good oxygen barrier capability. In most reflow profiles, the solder paste is at temperatures above 150ºC for more than several minutes. During this time, an oxygen barrier is needed to protect both the solder particles and the surfaces of the pads and leads.

A common example of an insufficient solder barrier is the graping defect or its relative, the head-in-pillow defect. If you are experiencing one of these defects, a solder paste with better oxygen barrier properties is bound to help.

Before reflow, the solder paste must print well, possess good response-to-pause, not shear thin, resist cold slump, and have good “tack” to support the components after placement. During reflow, in addition to the oxygen barrier challenge, the solder paste must not exhibit hot slump, should “Avoid the Void,” not create the “head-in-pillow” (HIP) defect, work with all common PWP pad finishes, and produce reliable solder joints in thermal cycling, drop shock, and vibration environments. Whew! What a complex challenge.

As a result I would argue that solder paste is a candidate to be the most highly engineered material in the world… and it certainly is NOT a commodity.

Cheers,
Dr. Ron

 

Tariffs are Taxing the Supply Chain

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The breaking tariff situation in the electronics industry is equal parts fascinating and chilling because of its lack of near-term precedence and unpredictability. We’ve spoken with several EMS companies (read the article here) to gauge the extent of the disarray and get a sense of how they are (attempting to) resolve the issue.

Our reporting is ongoing, so be sure to check back occasionally for updates.