Tag Archives: latest issue

The March Issue of PCD&F/CA

Posted on by

… is now out.

The cover story, “Bridging Technology between Conventional 3D and TSV 3D Stacking,” looks at two new multi-die DRAM packages with thin profiles that minimize wirebond length.

Among the other features:

  • My recap of the Apex Expo trade show in February.
  • Some key areas of the Benchmark Electronics’ Robotics manufacturing process, from a prototype or new-build stage to steady-state production.
  • The new IPC-2221B design standard.
  • Designing high-speed, small area boards.
  • Determining whether a process generate an electrostatic charge, and if so, how much.
  • We answer the question, Can a flex circuit be made with platinum or gold conductors rather than copper?
  • Selective soldering dwell times.
  • And the latest in a yearlong PCD&F series highlighting promising new enterprises in printed circuit board design looks at startup CircuitHub’s user-driven parts library.

Check it out.