Folks,

Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had was wave soldering. In wave soldering, the flux’s main job is to remove the oxides from the PWB pads and components. The solder is in a molten state and its oxidation is not a main concern. In the soldering process, the solder only touches the board for a few seconds and the board only experiences high temperatures during this brief period.

I imagine some early solder pastes consisted of solder powder with fluxes similar to those used in wave soldering. If so, they probably didn’t work too well. Consider the dramatic differences that solder paste experiences as compared to solder in wave soldering. The “flux” in solder paste has to remove oxides from the PWB pads, component leads and solder particles, but it also has to protect all of these surfaces from re-oxidation for several minutes in the reflow oven. To achieve this protection, the “flux” has to contain materials that act as oxygen barriers. The most common oxygen barrier materials used in no-clean solder pastes are rosins/resins. Rosins, or resins, which are modified or synthetic rosins, are generally medium- to high-molecular weight organic compounds of 80-90% abietic acid. They are typically found in coniferous trees. Rosins/resins are tacky in nature, they provide some fluxing activity, and provide the critical oxidation resistance during the reflow process.

The reason I wrote “flux” in quotation marks in the above paragraph is that what most people call the flux in solder paste is actually a complex combination of materials. These “fluxes” consist of:

• Rosins/resins: for oxygen barrier and some fluxing activity
• Rheological additives: to give the best printing properties. e.g. good response to pause, good transfer efficiency, excellent slump resistance, good tack, etc
• Solvents: to dissolve the other materials
• Activators: to perform the main fluxing action (removing oxides).

Because of these complexities, and the material’s multi-functionality, they are sometimes referred to as, “flux-vehicles.”

Modern solder pastes must have good oxygen barrier capability. In most reflow profiles, the solder paste is at temperatures above 150°C for several minutes. During this time an oxygen barrier is needed to protect both the solder particles and the surfaces of the pads and leads.

The graping defect. A common example of cases where the solder barrier was insufficient is seen in the graping defect, or its relative, the head-in-pillow defect. If you are experiencing one of these defects, a solder paste with better oxygen barrier properties is bound to help.

Cheers,

Dr. Ron