What Was Hot in 2011

Posted on by

Just for fun, let’s run down the top 10 articles published by CIRCUITS ASSEMBLY in 2011, based on web traffic:

10. “The Great Rebound of 2010.” Our annual look at the Top 50 EMS companies in 2010.

9. “Florida Sun Shines Light on Electronic Packaging Trends,” by Jan Vardaman. Jan’s recap of the annual ECTC conference.

8. “From Roadmaps to Research.” Mike Buetow’s interview with iNEMI CEO Bill Bader.

7. “Effects of a Dual Nozzle on Process and Quality.” Alan Cable looks at selective soldering.

6. “Vision Quest,” by Mike Buetow.  Our roundtable with a number of top placement OEM suppliers.

Tomorrow, the Top 5 from 2011.

This entry was posted in Hot Wires by Mike. Bookmark the permalink.

About Mike

Mike Buetow is president of the Printed Circuit Engineering Association (pcea.net). He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow